BDX33 thru BDX33d npn silicon power darlingtons $evroxwh0d[lpxp5dwlqjv# &8qohvv2wkhuzlvh1rwhg symbol rating value unit v cbo collector-base voltage (i e =0) BDX33 BDX33a BDX33b BDX33c BDX33d 45 60 80 100 100 v v ceo collector-emitter voltage (i b =0) BDX33 BDX33a BDX33b BDX33c BDX33d 45 60 80 100 100 v v ebo emitter-base voltage 5.0 v i c continuous collector current 10 a i b continuous base current 0.3 a p tot continuous device dissipation at (or below) 25 : case temperature (see note2) 70 w p tot continuous device dissipation at (or below) 25 : free air temperature (see note 3) 2.0 w t j operating free air temperature range -55~+150 : t stg storage temperature range -55~+150 : t a operating free-air temperature range -55~+150 : (ohfwulfdo&kdudfwhulvwlfv# &8qohvv2wkhuzlvh6shflilhg symbol parameter min typ max unit v (br)ceo collector-emitter breakdown voltage (i c =100ma, i b =0,see note 3) BDX33 BDX33a BDX33b BDX33c BDX33d 45 60 80 100 100 v
omponents 20736 marilla street chatsworth !"# $
% !"# mcc revision: c 2013/01/01 tm micro commercial components ? designed for complementary use with bdx34, bdx34a, bdx34b, bdx34c and bdx34d ? 70w at 25 : cass temperature ? 10a continuous collector current ? minimum h fe of 750 at 3.0v, 3.0a www.mccsemi.com 1 of 4 pin 1. base pin 2. collector pin 3. emitter g r b q h u l d c j k a f s t 1 3 2 n v min max note a .560 .625 14.22 15.88 b .380 .420 9.65 10.67 c .140 .190 3.56 4.82 d .020 .045 0.51 1.14 f .139 .161 3.53 4.09 ? g .190 .110 2.29 2.79 h --- .250 --- 6.35 j .012 .025 0.30 0.64 k .500 .580 12.70 14.73 l .045 .060 1.14 1.52 n .190 .210 4.83 5.33 q .100 .135 2.54 3.43 r .080 .115 2.04 2.92 s .045 .055 1.14 1.39 t .230 .270 5.84 6.86 u ----- .050 ----- 1.27 v .045 ----- 1.15 ----- dimensions inches mm dim min max to-220 ? lead free finish/rohs compliant(note 1 ) ("p" suffix designates rohs compliant. see ordering information) 2. derate linearly to 150 : case temperature at the rate of 0.56 w/ : 3. derate linearly to 150 : free air temperature at the rate of 16m w/ : notes: 1. high temperature solder exemption applied, see eu directive annex 7. epoxy meets ul 94 v-0 flammability rating moisure sensitivity level 1 mounting torgue: 5 in-lbs maximum ? features halogen free available upon request by adding suffix "-hf"
BDX33 thru BDX33d symbol parameter min typ max unit i ceo collector-emitter cut-off current (v c e =30v, i b =0) BDX33 (v c e =30v, i b =0) BDX33a (v c e =40v, i b =0) BDX33b (v c e =50v, i b =0) BDX33c (v c e =60v, i b =0) BDX33d (v c e =30v, i b =0, t c =100 : ) BDX33 (v c e =30v, i b =0, t c =100 : ) BDX33a (v c e =40v, i b =0, t c =100 : ) BDX33b (v c e =50v, i b =0, t c =100 : ) BDX33c (v c e =60v, i b =0, t c =100 : ) BDX33d 0.5 0.5 0.5 0.5 0.5 ?? ?? ?? ?? ?? ma i cbo collector cut-off current (v cb =45v, i e =0) BDX33 (v cb =60v, i e =0) BDX33a (v cb =80v, i e =0) BDX33b (v cb =100v, i e =0) BDX33c (v cb =100v, i e =0) BDX33d (v cb =45v, i e =0, t c =100 : ) BDX33 (v cb =60v, i e =0, t c =100 : ) BDX33a (v cb =80v, i e =0, t c =100 : ) BDX33b (v cb =100v, i e =0, t c =100 : ) BDX33c (v cb =120v, i e =0, t c =100 : ) BDX33d 1.0 1.0 1.0 1.0 1.0 ? ? ? ? ? ma i ebo emitter cut-off current (v eb =5.0v, i c =0) 10 ma h fe forward current transfer ratio (v ce =3.0v, i c =4.0a) BDX33 (v ce =3.0v, i c =4.0a) BDX33a (v ce =3.0v, i c =3.0a) (see notes 4 and 5) BDX33b (v ce =3.0v, i c =3.0a) BDX33c (v ce =3.0v, i c =3.0a) BDX33d 750 750 750 750 750 v be(on) base-emitter voltage (v ce =3.0v, i c =4.0a) BDX33 (v ce =3.0v, i c =4.0a) BDX33a (v ce =3.0v, i c =3.0a) (see notes 4 and 5) BDX33b (v ce =3.0v, i c =3.0a) BDX33c (v ce =3.0v, i c =3.0a) BDX33d 2.5 2.5 2.5 2.5 2.5 v v ce(sat) collector-emitter saturation voltage (i b =8.0ma, i c =4.0a) BDX33 (i b =8.0ma, i c =4.0a) BDX33a (i b =6.0ma, i c =3.0a) (see notes 4 and 5) BDX33b (i b =6.0ma, i c =3.0a) BDX33c (i b =6.0ma, i c =3.0a) BDX33d 2.5 2.5 2.5 2.5 2.5 v v ec parallel diode forward voltage (i e =8.0a, i b =0) 4.0 v notes: 4. these parameters must be measured using pulse techniques, tp=300 v gxw \ f\fo h 2%. 5. these parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts. 7khupd o &kdudfwhulvwlfv symbol parameter min typ max unit r -& junction to case thermal resistance 1.78 : /w r -$ junction to free air thermal resistance 62.5 : /w 5hvlvwlyh/rdg6zlwfklq j &kdudfwhulvwlf v d w : &dv h 7hpshudwxuh symbol parameter test conditions min typ max unit t on turn-on time 1.0 ? s t off turn-off time i c =3.0a, i b(on) =12ma, i b(off) =-12ma v be(off) =-3.5v, r l
w p v gf 2% 5.0 ? s voltage and current values shown are nominal; exact values vary slightly with transistor parameters. mcc revision: c 2013/01/01 tm micro commercial components www. mccsemi .com 2 of 4
figure 1. figure 2. typical dc current gain vs collector current i c - collector current - a 05 10 10 h fe - typical dc current gain 50000 100 1000 10000 tcs130af t c = -40c t c = 25c t c = 100c v ce = 3 v t p = 300 s, duty cycle < 2% collector-emitter saturation voltage vs collector current i c - collector current - a 05 10 10 v ce(sat) - collector-emitter saturation voltage - v 05 10 15 20 tcs130ah t c = -40c t c = 25c t c = 100c t p = 300 s, duty cycle < 2% i b = i c / 100 base-emitter saturation voltage vs collector current i c - collector current - a 05 10 10 v be(sat) - base-emitter saturation voltage - v 05 10 15 20 25 30 tcs130aj t c = -40c t c = 25c t c = 100c i b = i c / 100 t p = 300 s, duty cycle < 2% figure 3. thermal informatio n figure 4. maximum power dissipation vs case temperature t c - case temperature - c 0 25 50 75 100 125 150 p tot - maximum power dissipation - w 0 10 20 30 40 50 60 70 80 tis130ab mcc BDX33 thru BDX33d revision: c 2013/01/01 tm micro commercial components www. mccsemi .com 3 of 4
mcc revision: c 2013/01/01 tm micro commercial components www. mccsemi .com 4 of 4 ordering information : ***important notice*** micro commercial components corp. reserve s the right to make changes without further notice to any product herein to make corrections, modifications , enhancements , improvements , or other changes . micro commercial components corp . does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights ,nor the rights of others . the user of products in such applications shall assume all risks of such use and will agree to hold micro commercial components corp . and all the companies whose products are represented on our website, harmless against all damages. ***life support*** mcc's products are not authorized for use as critical components in life support devices or systems without the express written approval of micro commercial components corporation. ***customer awareness*** counterfeiting of semiconductor parts is a growing problem in the industry. micro commercial components (mcc) is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. mcc strongly encourages customers to purchase mcc parts either directly from mcc or from authorized mcc distributors who are listed by country on our web page cited below. products customers buy either from mcc directly or from authorized mcc distributors are genuine parts, have full traceability, meet mcc's quality standards for handling and storage. mcc will not provide any warranty coverage or other assistance for parts bought from unauthorized sources. mcc is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. device packing part number-bp bulk;1kpcs/box note : adding "-hf" suffix for halogen free, eg. part number-bp-hf
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